Features

· Precise numerical control integrated surface RGB shadowless light source

· All imported 10 million-pixel industrial cameras and lenses

· The equipment structure is highly integrated, easy to install and maintain, and the interface is easy to operate

· Online detection, seamless connection with production line MES

· The three-color algorithm truly restores the color of the cells and realizes high-precision color sorting of the cells

· Artificial intelligence technology realizes battery defect classification

· Big data analysis of defect distribution and defect cell distribution

Color imaging solution: use black and white CCD chip + RGB light source (same as GP)

· The number of red, green and blue photosensitive pixels is 25 million

· True color reproduction, high sensitivity, good contrast

· Natural black and white mode, more accurate color inspection and more advantages in defect detection

· Imaging is not affected by the color temperature of the light source (or ambient light)

Other competing imaging solutions: use color CCD chip + white light source

· Colors are formed by interpolation, not truecolor

· The number of red and blue photosensitive pixels accounts for 25%, which is equivalent to 6 million

· The number of green light-sensitive pixels accounts for 50%, which is equivalent to 12 million

· The color is not bright enough, and the color gamut is limited

Imaging effect & comparison of advantages and disadvantages

Plan	Three-color light + black and white camera	Monochromatic light + color camera
Number of photos	3 photos	1 photo
CT (photographing + processing)	850ms	600ms
Treatment (color, shape, graphics, defects)	Synchronous processing, CT does not increase with detection items	Serial processing, type increase CT increase
Algorithm	Ruili color, accurate sorting: easy to detect surface contamination under red light (such as watermarks)	The color is not bright enough, and the slight surface contamination cannot be recognized
Process convenience	Product switching without changing the underlying algorithm	Product switching needs to change the underlying algorithm

Device parameters

Project	Specification
Equipment ruler	Length 430mm Width 390mm Height 780mm
Applicable Wafer Size	156*156mm- 170*170mm
Applicable Wafer Type	Monocrystalline, polycrystalline, diamond wire monocrystalline, polycrystalline, PERC cells
Production capacity	Up to 3800PCS/hour
Front camera pixels/resolution	25 million, 34um
Rear Camera Pixels/Resolution	20 million, 48um (optional 25 million configuration for easy product upgrade)
UPTime	>99%
False positive rate	As low as <1%
False negative rate	As low as <0.1
Fragmentation rate	0%

Test items	defect type
size measurement	Side lengths, bends, diagonals, etc.
Damage detection	Damage, edge chipping, missing corners, grid line damage, cracks, etc.
printing offset	Including overall offset, grid line offset, main grid offset, etc.
Grid detection	Including broken grid, thinning, thickening, twisting, virtual printing, etc.
Dirt detection	Contains fingerprints, watermarks, screen dirt, etc.
Spot detection	Bright blue spots, small spots, white spots, dark red spots, slurry leakage, fingerprints, dripping oil, uncoated, diffusion boat prints, etch stains, etc.
Line Mark Detection	The grid line becomes thicker at the position where the scratch-like defect appears on the grid line
overshoot detection	Excessive etching on the surface of the product causes dark yellow or dark red color difference
Color difference detection	Single chip color difference, black silk chip, flower chip, light and dark chip, intra-chip color difference

Test items	defect type
size measurement	Side lengths, bends, diagonals, etc.
electrode offset	Including up and down offset, left and right offset, etc.
Electrode detection	Including electrode missing, damaged, warped, etc.
Dirt detection	Contains stains, fingerprints, oil stains, etc.
Spot detection	macula, plaque etc.
Color difference detection	In-chip chromatic aberration, yellowing, etc.